Plasma Applications in Semiconductor Manufacturing

Plasma has become semiconductor manufacturing'score foundational technology. In chip manufacturing processes, whether for etching, deposition, cleaning, or advanced packaging, plasma processes are almost indispensable. It makes chip processingmore precise, cleaner, and more efficient。

1. Dry etching — the “sculpting knife” of chip patterning

On a chip, photoresist is only a “mold”; what actually transfers the pattern onto silicon, metal, and dielectric films is plasma etching.

• Plasma is generated by RF, and reactive radicals and ion bombardment drive chemical reactions and physical etching;

• It enables nanometer-scale linewidth control and is an essential process for advanced nodes (7nm, 5nm, 2nm);

• Etching is cleaner, pattern profiles are more vertical, and residue is reduced, ensuring stable chip performance.

2. Thin-film deposition — the “stacking foundation” of chip structures

A chip consists of many thin films, such as dielectric films, metal films, and semiconductor films. Plasma-assisted deposition is the industry mainstream, including PECVD, sputtering, etc.

• Thin films can be deposited at low temperatures without damaging the underlying structure;

• Films are denser and more uniform, enabling nanometer-scale thickness control;

• It is a core technology foundation for continuously increasing chip integration density.

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3. Wafer cleaning — the “lifeline” of chip yield

Particles, organic matter, and metallic impurities on the wafer surface can cause leakage, short circuits, or yield loss.

• Using oxygen, argon, hydrogen, and other plasmas, it can achieveliquid-free, residue-free dry cleaning；

• effectively removes microparticles, organic residues, and native oxide layers;

• ensures the stability of subsequent processes such as photolithography, etching, and bonding.

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Summary:

Plasma enables semiconductor processes to achievenanoscale processing, low-temperature processing, and green, residue-free operation, and it is a core technology indispensable to the modern chip industry.