High-performance type power device test socket for TO-247-3 and TO-220 3 package T3P-HH-KL-250 (high-temperature 250 °C)

Its socket is designed for high-performance applications.

It meets the needs of individual semiconductor devices.

Similar to power transistors and thyristors.

It supports high current and high voltage.

As well as high-temperature environments.

The socket is compatible with packages such as:

3-terminal packages like TO-247-3 and TO-220.

Heaters or heat sinks can be installed.

On the back label of the device,

making it suitable for thermal characteristic analysis.

Characteristics of this device.

- High current: DC 55A at 25°C.

Acceptable packages:

TO-247, TO-3P, TO-264, TO-247 4L, and TO-220, etc.