PHS-200 Series Professional

High-Power High-Temperature Simulation System Without Airflow

PHS-200 is a professional-grade junction temperature simulation system without airflow, designed to meet the junction temperature control of packaged GaN power devices and high-power SiC modules. It can be used with IWATSU Iwasaki's CS-3000/5000/8000 series, Keysight's B150X power device analyzers, forming a power device temperature-electric parameter analysis system, completing the calibration testing of power device datasheets with one click.

At the same time, PHS-200, by matching with HSF professional test boxes and the THF-MH series professional hot plates, can also meet functions similar to Probestation probe stations, and can be adapted for high-temperature performance verification of wafers, dices, and thin-film materials.

Advantages:

n Airflow-free temperature control architecture, compliant with JEDEC standards

n Supports both discrete devices and power modules for dual-scenario adaptation

n Large-size heating plate, meeting heating requirements for full-specification modules

n  Standard electrical interface, various temperature platform options available

n  Safety interlock and high electrical insulation structure

n  Optional junction temperature measurement module, using JEDEC JESD51-1 standard method to achieve k-factor calibration and characteristics testing under junction temperature, meeting JESD47/IEC/AEC-Q101/AQG-324 test requirements.

n  Suitable for WBG device R&D, SiC module testing, MOSFET datasheet calibration