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For TOLL type GaN device test socket sem JC Electronics Catalog
For TOLL type GaN device test socket semiconductor SiC/GaN MOSFET mounting fixture dynamic / static parameters precision evaluation JC GD17-TOLL-K-FL
  • For TOLL type GaN device test socket semiconductor SiC/GaN MOSFET mounting fixture dynamic / static parameters precision evaluation JC GD17-TOLL-K-FL

For TOLL type GaN device test socket semiconductor SiC/GaN MOSFET mounting fixture dynamic / static parameters precision evaluation JC GD17-TOLL-K-FL

Brand: JC Electronics

Origin: Japan

Power device test:SiC/GaN high-low-temperature, high-, high-voltage, high-current, low inductance. provides and type package, TOLL, QDPAK, R2PAK and HU3PAK
Overview

Using our JCx series of high-reliability test sockets and dedicated fixtures, you can maximize the full performance potential of SiC/GaNMOSFETs during measurement.

The fixtures use specialized connectors and device mounting materials in collaboration with Japan's ]°C Corporation, suitable for stable evaluation of static parameters of various DIP and SMD package devices under normal and high/low temperature conditions

; Using low-inductance test sockets for dynamic parameter evaluation can yield excellent stable data.


JCx accurately assesses the performance of TO-3P and TO-247 package power devices for development and manufacturing. Our test sockets offer innovative technology and high reliability to

maximize the performance of MOSFETs built with next-generation semiconductor materials such as SiC (silicon carbide) and GaN (gallium nitride).

Our sockets are specifically designed for static semiconductor parameters, dynamic switching parameters, and device HTRB reliability testing,

maintaining stable electrical and mechanical integrity even under harsh conditions.


High-speed switching signals—low LS and Kelvin precision measurement and evaluation Our test sockets are designed to fully extract the device's high-speed switching performance and achieve precise evaluation.

Our sockets use standard Kelvin connections to isolate current measurement paths from voltage sensing paths. This eliminates the impact of wiring and contact resistance on voltage drop,

ensuring high-precision measurements.


Surface Mount Power Device Test Sockets: high and low temperatures, high reliability, high voltage, high current, low inductance in the SiC/GaN era.

We offer a variety of test sockets compatible with new surface-mount packages that have attracted industry attention, such as TOLL, ODPAK, R2PAK, and HU3PAK.


Through-hole mount power device test sockets

for through-hole mount power device

test sockets: compatible with TO-247-4L, TO-3P, and more. We offer a comprehensive lineup of high-performance test sockets compatible with through-hole mount packages like TO-247-4L and TO-3P

. Our sockets use Kelvin connections, enabling accurate evaluation of high-speed switching performance of MOSFET chips in packages like TO-247-4L.


Additionally, we offer products with high-performance designs capable of handling up to DC 50A current


Specifications




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Expand For TOLL type GaN device test socket sem

* Specifications are subject to change without notice.