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Jectronic Instruments
Overview
PHS-500 Series Expert Level
Air-Free Type -55~200℃ High and Low Temperature Environmental Simulation System
The PHS-500 is a professional high and low temperature air-free environment control system, utilizing advanced control technology and new material processes; it is specially developed and adapted for expert-level high and low temperature junction temperature simulation systems for materials, wafers, and packaging modules. The air-free design achieves a much faster high and low temperature change rate compared to traditional high and low temperature chambers while ensuring temperature stability. It also features a compact size, clear functional structure, and simple operation; making it particularly suitable for research and development of new products such as power devices, modules, electronic materials, medical materials, and electrical performance devices requiring specialized high and low temperature environments.
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Specifications
Advantages and Features:
n Ultra-wide temperature range, perfectly covers automotive standard -40~200℃
n Anti-condensation, explosion-proof, high-pressure safety interlock design
n Supports windless temperature cycling, high-rate temperature shock, and accelerated life testing
n Supports vacuum environment control
n Supports flow control of inert gases such as nitrogen
n A variety of complex test boxes are available, including high temperature, high and low temperature, high and low temperature vacuum, and high and low temperature special gas conditions.
n Specifically designed for the research and development of new materials, automotive-grade certification, and extreme condition testing
n Safety design: Fully electrical isolation Anti-condensation Explosion-proof Optical
n Applicable standards: AEC-Q101 / AQG-324 / IEC 60747
Key Parameters:
n Maximum temperature range: -40~300℃
n Temperature controlaccuracy:≤±1%±1℃
n Temperature uniformity:≤±1%±2℃
n Heating rate: -40℃ → 150℃ ≤ 15 min
PHS-500The series of hosts is aimed at scenarios for analyzing electrical parameters at high and low temperatures on large flat or irregular flat surfaces. |
Cooling rate: 150℃ → -40℃ ≤ 40 min (vacuum)
n Communication interface: RS485
n Supports direct insertion of components such as chip DBC, CHIP, magnetic cores, and inductors.
n The host computer software is standardly equipped to control heating, cooling, temperature maintenance, and automatically adjust the fluid flow rate.
n THERMAL PLATESize options available, from 40*40mm to a maximum of 300*300mm Multiple specifications available
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* Specifications are subject to change without notice.