Teledyne LeCroy
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Probemart.com | Probes, current sensors & calibration sources for pulsed-power testing
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Teledyne LeCroy
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Key features
Ideal probe for power conversion up to 48 V
250 MHz, 500 MHz, and 1 GHz bandwidth
80 V dynamic range
60 V common-mode
Highest accuracy
0.5% gain accuracy
Precision gain calibration
Best low-frequency flatness (0.1 dB)
Lowest noise and highest rejection
Wide range of tip types
High-performance solder-in
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Single-pin and header
Mini and micro grabbers
Socket connection
High-temperature solder-in
Y-banana adapter
ProBus active probe interface
Ideal probe for GaN power conversion up to 48V
The 60 V common-mode and 80 V differential input ranges and 1 GHz bandwidth make these probes ideal for low-voltage GaN power conversion measurements.
The 60 V common-mode range is well suited to handle any floating and bulk/absorption voltages of the battery during charging, while the 80 V differential input range provides sufficient margin for any overshoot.
Highest accuracy
The DL-HCM probe is calibrated to perform high-accuracy measurements within 0.5% at DC and to achieve 100 dB flatness over the frequency range from DC to 0.1 MHz.
This ensures high-accuracy measurement of the top and bottom voltage levels of pulse-width-modulated signals. The precision gain calibration function further improves measurement accuracy,
improving gain accuracy and eliminating small offset drift in the measurement setup.
Lowest noise and highest rejection
The probe's common-mode rejection ratio (CMRR) is excellent at very high frequencies. This makes it possible, when measuring the very fast slopes (high dV/dt) typical in GaN devices and systems
for PWM signals, to provide the best measurement performance. Excellent CMRR combined with low probe noise and high offset capability enables the probe to measure very small control signals floating on a high common-mode voltage.
Various probe types
The 60 V common-mode differential probe offers a well-balanced combination of high performance and flexibility for connecting to any device under test. Optional accessory kits and high-temperature solder-in probes provide additional connection options.
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